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Volumn , Issue , 2008, Pages 1048-1053

Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; ELECTRONIC PACKAGING; PERIDYNAMIC THEORY;

EID: 51449086761     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550105     Document Type: Conference Paper
Times cited : (13)

References (12)
  • 4
    • 0346055020 scopus 로고    scopus 로고
    • Reformulation of Elasticity Theory for Discontinuities and Long-Range Forces
    • Silling, S. A., "Reformulation of Elasticity Theory for Discontinuities and Long-Range Forces," Journal of Mechanics and Physics of Solids, Vol. 48, 2000, pp. 175-209.
    • (2000) Journal of Mechanics and Physics of Solids , vol.48 , pp. 175-209
    • Silling, S.A.1
  • 7
    • 51449100089 scopus 로고    scopus 로고
    • JEDEC Standard JESD22-B 111.
    • JEDEC Standard JESD22-B 111.
  • 8
    • 33748543601 scopus 로고    scopus 로고
    • Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact
    • Luan, J., et al, "Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact," IEEE Transaction on Components and Packaging Technologies, Vol. 29, 2006, pp. 449-456
    • (2006) IEEE Transaction on Components and Packaging Technologies , vol.29 , pp. 449-456
    • Luan, J.1
  • 9
    • 2942740958 scopus 로고    scopus 로고
    • Impact Life prediction modeling of TFBGA packages under Board Level Drop Test
    • Tee, T. Y., et al, "Impact Life prediction modeling of TFBGA packages under Board Level Drop Test," Microelectronics Reliablitiy, Vol 44, 2004, pp. 1131-1142.
    • (2004) Microelectronics Reliablitiy , vol.44 , pp. 1131-1142
    • Tee, T.Y.1
  • 10
    • 17744377618 scopus 로고    scopus 로고
    • A Meshfree Method Based on the Peridynamic Model of Solid Mechanics
    • Silling, S. A., and Askari, E., "A Meshfree Method Based on the Peridynamic Model of Solid Mechanics," Computers and Structures, Vol. 83, 2005, pp. 1526-1535.
    • (2005) Computers and Structures , vol.83 , pp. 1526-1535
    • Silling, S.A.1    Askari, E.2
  • 11
    • 0000437550 scopus 로고
    • Failure mode transition at high rates of shear loading
    • C. Y. Chiem, H.-D. Kunze, and L. W. Meyer, eds, DGM Informationsgesellschaft Verlag
    • J. F. Kalthoff and S. Winkler, "Failure mode transition at high rates of shear loading," in Impact Loading and Dynamic Behavior of Materials, C. Y. Chiem, H.-D. Kunze, and L. W. Meyer, eds., Vol 1, DGM Informationsgesellschaft Verlag (1988) pp. 185-195.
    • (1988) Impact Loading and Dynamic Behavior of Materials , vol.1 , pp. 185-195
    • Kalthoff, J.F.1    Winkler, S.2
  • 12
    • 51449115195 scopus 로고    scopus 로고
    • Peridynamic Modeling of the Kalthoff-Winkler Experiment,private communication
    • Silling, S. A., "Peridynamic Modeling of the Kalthoff-Winkler Experiment,"private communication, 2002.
    • (2002)
    • Silling, S.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.