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Volumn , Issue , 1999, Pages 721-726
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Effects of epoxy molding compound composition on the warpage and popcorn resistance of PBGA
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
COMPOSITION EFFECTS;
COMPUTER SOFTWARE;
ELECTRONICS PACKAGING;
ENCAPSULATION;
MOISTURE DETERMINATION;
SHEET MOLDING COMPOUNDS;
STRENGTH OF MATERIALS;
THERMAL EXPANSION;
ADHESION STRENGTH;
FILLER CONTENT;
HARDENER TO EPOXY EQUIVALENT RATIO;
PLASTIC BALL GRID ARRAY;
POPCORN RESISTANCE;
SOLDER MASK;
STRESS RELEASE AGENT;
WARPAGE;
EPOXY RESINS;
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EID: 0032668888
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (8)
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References (3)
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