Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1787-1792

  Tian, J ^a   Bartek, M ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CELLULAR RADIO SYSTEMS; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; ELECTRON BEAM LITHOGRAPHY; ETCHING; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE DROP; SILICON; THREE DIMENSIONAL;

ELECTRONIC COMPONENTS; ETCH-STOP LAYER; FABRICATION TECHNIQUES;

REACTIVE ION ETCHING;

EID: 51349150845     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550223     Document Type: Conference Paper

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