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Volumn , Issue , 2008, Pages 198-202

Determining thermal simulation data from transient measurements

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; HEAT RESISTANCE; HEAT TRANSFER; POWER AMPLIFIERS; SEMICONDUCTOR MATERIALS; STRUCTURAL OPTIMIZATION; THERMAL VARIABLES MEASUREMENT; TRANSFER FUNCTIONS;

EID: 51349132519     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2008.4509390     Document Type: Conference Paper
Times cited : (3)

References (14)
  • 2
    • 0026191015 scopus 로고
    • On The Representation of Infinite-Length Distributed RC One-Ports
    • Szekely, V., 'On The Representation of Infinite-Length Distributed RC One-Ports', IEEE Trans Circuits Systems, Vol. 38, pp. 711-719, 1991.
    • (1991) IEEE Trans Circuits Systems , vol.38 , pp. 711-719
    • Szekely, V.1
  • 3
    • 0024069775 scopus 로고    scopus 로고
    • Fine Structure of Heat Flow Path in Semiconductor Devices: Measurement and Identification Method
    • Szekely, V., T. Van Bien, 'Fine Structure of Heat Flow Path in Semiconductor Devices: Measurement and Identification Method', Solid-State Electronics, Vol. 31, pp. 1363-1368, 1998.
    • (1998) Solid-State Electronics , vol.31 , pp. 1363-1368
    • Szekely, V.1    Van Bien, T.2
  • 4
    • 47749125215 scopus 로고    scopus 로고
    • New Methods and Supporting Tools for The Thermal Transient Testing of Packages
    • Rencz, M., V. Szekely, A. Poppe, G. Farkas, B. Courtois, 'New Methods and Supporting Tools for The Thermal Transient Testing of Packages', Proc of APACK, pp. 407-411, 2001.
    • (2001) Proc of APACK , pp. 407-411
    • Rencz, M.1    Szekely, V.2    Poppe, A.3    Farkas, G.4    Courtois, B.5
  • 5
    • 36849023032 scopus 로고    scopus 로고
    • Thermal characterization of electronic packages using the Nyquist plot of thermal impedance
    • Kawka, P., DeMey, Vermeersch, 'Thermal characterization of electronic packages using the Nyquist plot of thermal impedance, IEEE Trans on Components and Packaging Technologies, Vol. 30, pp. 660-665, 2007.
    • (2007) IEEE Trans on Components and Packaging Technologies , vol.30 , pp. 660-665
    • Kawka, P.1    DeMey, V.2
  • 7
    • 33846634689 scopus 로고    scopus 로고
    • Thermal Analysis of Layered Electronic Circuits with Green's Functions'
    • Janicki, M., G. De Mey, A. Napieralski, 'Thermal Analysis of Layered Electronic Circuits with Green's Functions', Microelectronics Journal, Vol. 38, pp. 177-184, 2007.
    • (2007) Microelectronics Journal , vol.38 , pp. 177-184
    • Janicki, M.1    De Mey, G.2    Napieralski, A.3
  • 8
    • 21044442560 scopus 로고    scopus 로고
    • Four Decades of Research on Thermal Contact, Gap, and Joint Resistance in Micro-Electronics
    • Yovanovich, M., 'Four Decades of Research on Thermal Contact, Gap, and Joint Resistance in Micro-Electronics, IEEE Trans on Components and Packaging Technologies, Vol. 28, pp. 182-206, 2005.
    • (2005) IEEE Trans on Components and Packaging Technologies , vol.28 , pp. 182-206
    • Yovanovich, M.1
  • 9
    • 15744402676 scopus 로고    scopus 로고
    • Analytical Transient Solution of Heat Equation with Variable Heat Transfer Coefficient
    • Janicki, M., A. Napieralski, "Analytical Transient Solution of Heat Equation with Variable Heat Transfer Coefficient", Proc. THERMINIC, pp. 235-240, 2002.
    • (2002) Proc. THERMINIC , pp. 235-240
    • Janicki, M.1    Napieralski, A.2
  • 10
    • 47749091689 scopus 로고    scopus 로고
    • Application of RC equivalent networks to modelling of nonlinear thermal phenomena
    • Kaminski, M., M. Janicki, A. Napieralski, 'Application of RC equivalent networks to modelling of nonlinear thermal phenomena', Proc MIXDES, pp. 357-362, 2007.
    • (2007) Proc MIXDES , pp. 357-362
    • Kaminski, M.1    Janicki, M.2    Napieralski, A.3
  • 11
    • 15744377392 scopus 로고    scopus 로고
    • Transient temperature fields with general nonlinear boundary conditions in electronic systems
    • Wachutka, Y. Gerstenmaier, Transient temperature fields with general nonlinear boundary conditions in electronic systems, IEEE Tran Components Packaging Technologies, Vol. 28, pp. 23 - 33, 2005.
    • (2005) IEEE Tran Components Packaging Technologies , vol.28 , pp. 23-33
    • Wachutka, Y.G.1
  • 13
    • 47749128944 scopus 로고    scopus 로고
    • Application of advanced thermal analysis method for investigation of internal package structure
    • Banaszczyk, J., M. Janicki, B. Vermeersch, G. De Mey, A. Napieralski, "Application of advanced thermal analysis method for investigation of internal package structure", Proc. MIXDES, pp. 553-558, 2007.
    • (2007) Proc. MIXDES , pp. 553-558
    • Banaszczyk, J.1    Janicki, M.2    Vermeersch, B.3    De Mey, G.4    Napieralski, A.5
  • 14
    • 50249106464 scopus 로고    scopus 로고
    • Short time die attach characterization of LEDs for in-line testing application
    • Singapore; pp
    • Szabo, P., M. Rencz, G. Farkas, A. Poppe, "Short time die attach characterization of LEDs for in-line testing application", Proc. EPTC, Singapore; pp. 360-366, 2006.
    • (2006) Proc. EPTC , pp. 360-366
    • Szabo, P.1    Rencz, M.2    Farkas, G.3    Poppe, A.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.