Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 660-665

  Kawka, Piotr ^a   De Mey, Gilbert ^b   Vermeersch, Bjorn ^b  

^a AGILENT TECHNOLOGIES   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

Dynamic behavior; Electronic package; Nyquist plot; Thermal characterization; Thermal impedance

Indexed keywords

CURVE FITTING; ELECTRIC IMPEDANCE; NYQUIST DIAGRAMS; THERMODYNAMIC PROPERTIES;

NYQUIST PLOT; THERMAL CHARACTERIZATION; THERMAL IMPEDANCE;

ELECTRONICS PACKAGING;

EID: 36849023032     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.906308     Document Type: Conference Paper

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