Reliability testing of through-silicon vias for high-current 3D applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 879-883

  Wright, Steven L ^a   Andry, Paul S ^a   Sprogis, Edmund ^b   Dang, Bing ^a   Polastre, Robert J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATIONS.; ELECTRONIC COMPONENTS; HIGH CURRENTS; VIA INTERCONNECTION;

COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; RELIABILITY; SOLDERING;

NONMETALS;

EID: 51349126973     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550080     Document Type: Conference Paper

References (8)

1. Knickerbocker, J.U., et al, "Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch interconnection," IBM J. Res. Dev. 49 (4/5), 2005, pp. 725-754.
2. Knickerbocker, J.U., et al, "Three-dimensional Silicon Integration," submitted to IBM J.Res. Dev.
3. Andry, P.S., et al, "A CMOS-compatible process for fabricating electrical through-vias in silicon," Proc 56th Electronic Components and Technology Conf, San Diego, CA, May 2006, pp. 831-837.
4. Andry, P.S., et al, "Design and fabrication of robust through-silicon vias," submitted to IBM J. Res. Dev.
5. Patel, C.S., et al, "Silicon carrier with deep through-vias, fine pitch wiring, and mrough cavity for parallel optical receiver," Proc 55th Electronic Components and Technology Conf, Lake Buena Vista, FL, May 2005, pp. 1318-1324.
6. Tsang, C.K., et al, "CMOS-compatible silicon through-vias for 3D process integration," Proc. Mat. Res. Soc., Boston MA, 2006, pp. 145-153.
7. Wright, S.L., et al, "Characterization of microbump C4 interconnets for Si-carrier SOP applications," Proc 56th Electronic Components and Technology Conf, San Diego, CA, May 2006, pp. 633-640.
8. Dang, B., et al, "Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package," Proc 57th Electronic Components and Technology Conf, Reno, NV, May 2007, pp. 42-48.