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Volumn , Issue , 2007, Pages 321-328
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Ultra fast calculation of temperature profiles of VLSI ICs in thermal packages considering parameter variations
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Author keywords
Finite element analysis (FEA); Power Blurring (PB); Temperature profile; Thermal mask parameterization; Thermal package
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Indexed keywords
CONVOLUTION TECHNIQUES;
HEAT CONDUCTION EQUATIONS;
POWER BLURRING (PB);
SPATIAL IMPULSE RESPONSE;
STEADY-STATE TEMPERATURE;
TEMPERATURE PROFILES;
THERMAL PACKAGE;
ULTRA-FAST CALCULATIONS;
ATMOSPHERIC TEMPERATURE;
CMOS INTEGRATED CIRCUITS;
CONVOLUTION;
FINITE ELEMENT METHOD;
IMPULSE RESPONSE;
MICROELECTRONICS;
PARAMETERIZATION;
TEMPERATURE CONTROL;
THERMOANALYSIS;
THERMAL CONDUCTIVITY;
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EID: 84876948716
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (7)
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