DJOSER: Analytical thermal simulator for multilayer electronic structures. Theory and numerical implementation

1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1

Volumn , Issue , 2007, Pages 77-84

  Bagnoli, Paolo Emilio ^a   Casarosa, Claudio ^a   Stefani, Fabio ^a  

^a UNIVERSITY OF PISA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

THERMAL CONTACT RESISTANCES; THERMAL SIMULATION STRATEGY; THERMAL SIMULATORS;

COMPUTER SIMULATION; CONTACT RESISTANCE; HEAT RESISTANCE; INTEGRAL EQUATIONS; MULTILAYERS; TEMPERATURE DISTRIBUTION;

ELECTRONICS PACKAGING;

EID: 36949000852     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THETA.2007.363413     Document Type: Conference Paper

References (11)

1. V. Kadambi, J. Abuaf, "An analysis of the thermal response of power chip package", IEEE Trans. Electron Devices, ED-3 (1973), 1024-1033.
2. C.C. Lee, A.L. Palisoc, J.M.W. Baynham, "Thermal analysis of solid-state devices using the boundary element Method", IEEE Transactions on Electron Devices, ED-35, (1988), 1151-1153
3. C.C. Lee, A.L. Palisoc, Y.J. Min, "Thermal analysis of integrated circuit devices and packages", IEEE Transaction on Components, Packaging, and Manufacturing Technology, Vol. 12, (1989), 701-709
4. M. Pesare, A. Giorgio and A.G. Perri, "Analytical approach for thermal and electrical design of multilayer structure integrated devices", Electronics Letter, Vol. 36, No. 13, (2000), 1020-1021.
5. N. Rinaldi, "Thermal analysis of solid-state devices and circuits: An analytical approach", Solid State Electronics. Vol. 44, no. 10, (2000), 1789-1798.
6. P.E. Bagnoli, C. Casarosa, S. di Pascoli, "Electrothermal Simulation of Hot-Spot Phenomena in Cellular Bipolar Power Transistors: the Influence of Package Thermal Resistance", Proceedings of IPACK2001, IPACK2001-15547, Kauai, Hawaii, USA, July 2001.
7. rd National UIT Conference, Parma, June 20-22, 2005.
8. th EPTC Conference, Singapore, December 2003.
9. Montesi, M., Bagnoli, P.E., Casarosa, C., Pasquinelli, M., "Steady-State thermal mapping of electronic devices with multi-layer stack mountings by analytical relationships". ITSS II ASME-ZSIS Conference, Bled, Slovenia, June 13-16, 2004.
10. Ozisik, M. N., Heat conduction, J.Wiley & Sons, New York, 1980.
11. Krasnov, M.L, Kiselev, A.I. and Makarenko, G.I., Integral Equations, Ed. MIR, Moscow, 1980.