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Volumn , Issue , 2007, Pages

Real-time compact electronic thermal modelling for health monitoring

Author keywords

IGBT; Modelling; Pulse width modulation (PWM); Real time processing; Reliability

Indexed keywords

ACTIVE FILTERS; APPLICATIONS; BRIDGES; COMPUTER NETWORKS; COUNTING CIRCUITS; FAILURE ANALYSIS; MODULATION; PHOTOLITHOGRAPHY; POWER ELECTRONICS; PULSE MODULATION; PULSE WIDTH MODULATION; QUALITY ASSURANCE; RELIABILITY ANALYSIS; TABLE LOOKUP; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

EID: 51049090345     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPE.2007.4417325     Document Type: Conference Paper
Times cited : (34)

References (10)
  • 1
    • 28444488009 scopus 로고    scopus 로고
    • Lifetime Assessment of Electronic Components for High Reliability Aerospace Applications
    • ISBN 0-7803-8821-6, Pub IEEE
    • S. Stoyanov, W. Mackay, C. Bailey, D Jibb, C Cregson, "Lifetime Assessment of Electronic Components for High Reliability Aerospace Applications", 6th Electronics Packaging Technology Conference - EPTC 2004, p324-329, ISBN 0-7803-8821-6, Pub IEEE, (2004).
    • (2004) 6th Electronics Packaging Technology Conference , vol.EPTC 2004 , pp. 324-329
    • Stoyanov, S.1    Mackay, W.2    Bailey, C.3    Jibb, D.4    Cregson, C.5
  • 2
    • 17044387683 scopus 로고    scopus 로고
    • Mahera Musallam, Paul P. Acarnley, C. Mark Johnson and Len Pritchard, Real-Time Power Electronic Device Junction Temperature Estimation, in Proc. PEMD 2004 International Conference on Power Electronics Machines and Drives, 2004, pp. 231-235.
    • Mahera Musallam, Paul P. Acarnley, C. Mark Johnson and Len Pritchard, "Real-Time Power Electronic Device Junction Temperature Estimation", in Proc. PEMD 2004 International Conference on Power Electronics Machines and Drives, 2004, pp. 231-235.
  • 5
    • 0036036222 scopus 로고    scopus 로고
    • An investigation of the structural and thermal transfer characteristics of commercial power MOSFET devices using experimental and modelling techniques
    • Conference Publication No.487
    • L.S. Pritchard, P.P. Acarnley and C.M. Johnson, 'An investigation of the structural and thermal transfer characteristics of commercial power MOSFET devices using experimental and modelling techniques', IEE International Conference on Power Electronics, Machines and Drives, Conference Publication No.487, 2002, pp. 562-567.
    • (2002) IEE International Conference on Power Electronics, Machines and Drives , pp. 562-567
    • Pritchard, L.S.1    Acarnley, P.P.2    Johnson, C.M.3
  • 7
    • 51049120935 scopus 로고    scopus 로고
    • www.mathworks.com
  • 8
    • 51049116832 scopus 로고    scopus 로고
    • www.dspace.ltd.uk
  • 10
    • 0038819109 scopus 로고    scopus 로고
    • Bosch, E.G.T. Components and Packaging Technologies, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, 26, Issue 1, March 2003, pp. 173-178.
    • Bosch, E.G.T. Components and Packaging Technologies, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, Volume 26, Issue 1, March 2003, pp. 173-178.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.