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Volumn , Issue , 2003, Pages 329-332

System integration - Thermal aspects of chip utilization of power devices and control

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INVERTERS; HIGH TEMPERATURE EFFECTS; MICROCONTROLLERS; POWER ELECTRONICS; PULSE WIDTH MODULATION; SILICON;

EID: 0042515270     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (8)
  • 1
    • 0042921137 scopus 로고    scopus 로고
    • System integration - A new milestone for future power electronic systems
    • Lorenz, Leo "System integration - a new milestone for future power electronic systems" EPE'97, Trondheim, Norway, Conf.-Proc.
    • EPE'97, Trondheim, Norway, Conf.-Proc.
    • Lorenz, L.1
  • 3
    • 76549118183 scopus 로고    scopus 로고
    • The calculation of power dissipation for the IGBT and the inverse diode in circuits with sinusoidal output voltage
    • Srajber,D.; Lukasch, W.: "The Calculation of Power Dissipation for the IGBT and the Inverse Diode in Circuits with Sinusoidal Output Voltage" Electronica'92, Munich,Germany, Conf.-Proc.
    • Electronica'92, Munich,Germany, Conf.-Proc.
    • Srajber, D.1    Lukasch, W.2
  • 8
    • 0042921136 scopus 로고    scopus 로고
    • TriCon-Datasheet http://www.isle-ilmenau.de/tricon.htm
    • TriCon-Datasheet


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.