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Volumn , Issue , 2003, Pages 329-332
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System integration - Thermal aspects of chip utilization of power devices and control
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC INVERTERS;
HIGH TEMPERATURE EFFECTS;
MICROCONTROLLERS;
POWER ELECTRONICS;
PULSE WIDTH MODULATION;
SILICON;
POWER DEVICES;
POWER CONTROL;
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EID: 0042515270
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (7)
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References (8)
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