메뉴 건너뛰기




Volumn 1, Issue , 2004, Pages 231-235

Real -time power electronic device junction temperature estimation

Author keywords

DSP; Intrinsic diode; MOSFET; Power switching devices; SDRAM; T model; Thermal model

Indexed keywords

DIGITAL SIGNAL PROCESSOR (DSP); INTRINSIC DIODE; POWER SWITCHING DEVICES; T-MODEL; THERMAL MODEL;

EID: 17044387683     PISSN: 05379989     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (6)
  • 3
    • 0036036222 scopus 로고    scopus 로고
    • An investigation of the structural and thermal transfer characteristics of commercial power MOSFET devices using experimental and modelling techniques
    • Conference Publication No.487
    • Pritchard L.S., Acarnley P.P. and Johnson C.M., 2002, 'An Investigation of the Structural and Thermal Transfer Characteristics of Commercial Power MOSFET Devices using Experimental and Modelling Techniques', IEE International Conference on Power Electronics, Machines and Drives, Conference Publication No.487, pp562-567.
    • (2002) IEE International Conference on Power Electronics, Machines and Drives , pp. 562-567
    • Pritchard, L.S.1    Acarnley, P.P.2    Johnson, C.M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.