Lifetime assessment of electronic components for high reliability aerospace applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 324-329

  Stoyanov, S ^a   Mackay, W ^b   Bailey, C ^a   Jibb, D ^b   Gregson, C ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b BAE SYSTEMS   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; CRACKS; FINITE ELEMENT METHOD; RELIABILITY;

ELECTRONIC COMPONENTS; THERMAL PROFILES;

ELECTRONICS PACKAGING;

EID: 28444488009     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Lau, H. J. and Pao, Yi-Hsin (ed.), Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill (New York, 1997).
2. Darveaux, R., Banerji, K., Mawer, A. and Doby, G., "Reliability of Plastic Ball Grid Array Assembly", In Ball Grid Array Technology, ed. J. Lau, McGraw-Hill (New York, 1995), pp. 379-442.
3. PHYSICA, Multi-Physics Software (MPS) Ltd., London, UK, http://www.multi-physics.com
4. Darveaux, R., "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation", Proceedings of 50th Electronic Components and Technology Conference, May 2000, pp. 1048-1058.
5. Clech, J. P., Noctor, D. M., Manock, J. C., Lynott, G. W. and Bader, F. E., "Surface Mount Failure Statistics and Failure Free Time", Proceedings 44th ECTC, Washington, DC, May 1-4, 1994, pp. 487-497.
6. Zahn, B., "Solder Joint Fatigue Life Model Methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu Materials", Proc. ECTC 2003 (2003), pp. 83-94.
7. Staab, G. H., Laminar Composites, Published by Butterworth-Heinemann (1999), pp. 71-97.