Failure models in power device interconnects

2007 European Conference on Power Electronics and Applications, EPE

Volumn , Issue , 2007, Pages

  Hansen, Peter ^a   McCluskey, Patrick ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

IGBT; Power cycling; Reliability; Thermal stress

Indexed keywords

APPLICATIONS; COMPUTER NETWORKS; MATHEMATICAL MODELS; PHOTOLITHOGRAPHY;

EUROPEAN; IGBT; POWER CYCLING; RELIABILITY; THERMAL STRESS;

POWER ELECTRONICS;

EID: 51049086342     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPE.2007.4417406     Document Type: Conference Paper

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