Power cycling on press-pack IGBTs: measurements and thermomechanical simulation

Microelectronics Reliability

Volumn 39, Issue 6-7, 1999, Pages 1165-1170

  Cova, Paolo ^a   Nicoletto, Gianni ^a   Pirondi, Alessandro ^a   Portesine, Marco ^b   Pasqualetti, Maurizio ^b  

^a UNIVERSITY OF PARMA   (Italy)

^b ANSALDO ENERGIA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT TESTING; PRESSURE EFFECTS; RELIABILITY; STRAIN; STRESSES; THERMAL EFFECTS;

CHIP PACKAGE ASSEMBLY; INSULATED GATE BIPOLAR TRANSISTORS; POWER CYCLING; TESTING RIG; THERMOMECHANICAL SIMULATION;

BIPOLAR TRANSISTORS;

EID: 0033145303     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00166-3     Document Type: Article

References (6)

1. Berg H and Wolfgang E. Advanced IGBT modules for railway traction applications: reliability testing. Micr. Reliab., 38 (1998) 1319-1323.
2. Hiyoshy M, Yanagisawa S, Nishitani K, Kotake K, Matsuda H, Teramae S, Baba Y. A 1000A 2500V pressure mount RC-IGBT. EPE 1995 Proc., pp. 1.051-1.054.
3. Nicoletto G, Pirondi A, Terzi M, Cova P, Fantini F, Camera A, Pasqualetti M, Portesine M, Zani PE. Thermo-mechanical structural analysis of a press-packed IGET. InterPack 1997 Proc., pp. 1707-1713.
4. Pirondi A, Nicoletto G, Cova P, Pasqualetti M, Portesine M, Zani PE. Thermo-mechanical simulation of a multichip press-packed IGBT. Solid State Electronics, 42 (1998) 2303-2307.
5. Cova P and Fantini F. On the effect of power cycling stress on IGBT modules. Micr. Reliab., 38 (1998) 1347-1352.
6. Johnson KL. Contact mechanics. Cambridge Univ. Press, 1985.