Embedding capacitors and resistors into printed circuit boards using a sequential lamination technique

Journal of Materials Processing Technology

Volumn 207, Issue 1-3, 2008, Pages 72-88

  Lee, H F ^a   Chan, C Y ^a   Tang, C S ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Embedded passives; Sequential lamination; Thin film process

Indexed keywords

CAPACITANCE; CAPACITORS; COMPUTER NETWORKS; DIELECTRIC DEVICES; ELECTRIC EQUIPMENT; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; INDUSTRIAL ECONOMICS; INTEGRATED CIRCUITS; LAMINATING; PAPER CAPACITORS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; RESISTORS; SIGNAL PROCESSING; SURFACE MOUNT TECHNOLOGY;

EMBEDDED PASSIVES; SEQUENTIAL LAMINATION; THIN FILM PROCESS;

PRINTED CIRCUIT BOARDS;

CAPACITORS; COST CONTROL; ELECTRIC CIRCUITS; ELECTRIC EQUIPMENT; ELECTROMAGNETIC RADIATION; POLYCHLORINATED BIPHENYLS; RELIABILITY; RESISTORS;

EID: 50949132935     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.12.051     Document Type: Article

References (10)

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