Embedded passives: Promising improved performance

Circuits Assembly

Volumn 12, Issue 7, 2001, Pages 28-39

  Marcanti, Larry ^a   Dougherty, Joseph P ^b  

^a NORTEL NETWORKS   (United States)

^b PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035398333     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. NEMI. 2000 Roadmap. Herndon, VA: National Electronics Manufacturing Initiative.
2. Ohmega Technologies Inc. Ohmega-Ply Cost Analysis. White paper. Culver City, CA, www.ohmega.com.
3. Takken, I, and D. Tuckerman. 1993. Integral decoupling capacitance reduces multichip module ground bounce. Proc. IEEE Multi-chip Module Conference. Santa Cruz, CA, pp. 79-84.
4. Realff, M., and C. Power. 1998. Technical cost modeling for decisions in integrated vs. surface mount passives. Proc. IMAPS 3rd Advanced Technology Workshop on Integrated Passives Technology. Denver, CO, April.
5. AEPT. The Advanced Embedded Passives Technology project is being conducted by the National Center for Manufacturing Sciences; http:// aept.ncms.oro/ and http://www.ncms.org/.