Embedded passives: The next revolution

Printed Circuit Fabrication

Volumn 25, Issue 11, 2002, Pages 26-29

  Snogren, Richard ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC CAPACITORS; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; INTEGRATED CIRCUITS; LASER BEAM EFFECTS; PASSIVE NETWORKS; RESISTORS; THIN FILMS;

EMBEDDED PASSIVES (EP);

PRINTED CIRCUIT BOARDS;

EID: 0036854989     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Joseph Dougherty, J. Galvagni, L. Marcanti, R. Sanborn, R. Charbonneau, and R. Sheffield, "The NEMI Roadmap Perspective on Integrated Passives" May 2001.
2. Don Cullen, B. Kline, G. Moderhock, and L. Gatewood, "Effects of Surface Finish on High Frequency Signal Loss Using Various Substrate Materials" IPC Printed Circuits Expo, April 2001.
3. John Savic, M. Zhang, A. Tungare, K. Noda, P. Tan, J. Herbert and W. Bauer, "Embedded Mezzanine Capacitor Technology for Printed Wiring Boards," IPC Printed Circuits Expo, March 2002.
4. HDI Simov Technologies.
5. John Felten, R. Snogren, and J. Zhou, "Embedded Ceramic Resistors and Capacitors in PWB: Process and Performance" IPC Annual Meeting, October 2001.
6. Joseph D'Ambrisi, D. Fritz, and D. Sawoska, "Plated Embedded Resistors for High Speed Circuit Applications" IPC Annual Meeting, October 2001.
7. Robert Greenlee, "Processing Thin Core Capacitor Materials" IPC Printed Circuits Expo, March 2002.
8. Kim Fjeldsted and S. Chase, "Embedded Passives: Laser Trimmed Resistors" CircuiTree, March 2002.
9. Virang Shah and D. Hayes, "Fabrication of Passive Elements Using Ink-Jet Technology" PC FAB, September 2002.