Embedded passive components for MCM

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2001-January, Issue , 2001, Pages 73-77

  Golonka, L J ^a   Wolter, K J ^b   Dziedzic, A ^a   Kita, J ^a   Rebenklau, L ^b  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; THICK FILMS;

ACTIVE DEVICES; DRESDENS; ELECTRONIC SYSTEMS; EMBEDDED COMPONENTS; EMBEDDED ELEMENT; EMBEDDED PASSIVE COMPONENTS; EMBEDDED PASSIVES;

CONCURRENT ENGINEERING;

EID: 84952882877     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2001.931015     Document Type: Conference Paper

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