Design considerations for thin-film embedded resistor and capacitor technologies

Circuit World

Volumn 31, Issue 1, 2005, Pages 21-27

  Chinoy, Percy ^a   Langlois, Marc ^a   Hariharan, Raj ^a   Nelson, Mike ^a   Cox, Anthony ^a   Ridler, Tony ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Capacitors; Design for assembly; Electrical components; Thin films

Indexed keywords

EMBEDDED PASSIVE TECHNOLOGY; RESISTOR DESIGN; RESISTOR TOLERANCE;

CAPACITORS; COST BENEFIT ANALYSIS; EMBEDDED SYSTEMS; FITS AND TOLERANCES; PERMITTIVITY; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; RESISTORS; TECHNOLOGY;

THIN FILMS;

EID: 4444233595     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120510553194     Document Type: Article

References (12)

1. Bauer, W., Purger, S. and Schrittwieser, W. (2003), "Embedded passive technology", Circuitree, October, p. 30.
2. Chinoy, P. and Hariharan, R. (2003), "Thermal and ESD characteristics of high ohmic value embedded resistors", Proceedings of IPC Conference on Embedded Passives, Northbrook, IL.
3. Chinoy, P. and Langlois, M. (2003), "InSite embedded resistor and capacitor technologies", IPC Expo Proceedings.
4. Chinoy, P., Langlois, M. and Schemenaur, J. (2002), "High ohmic value embedded resistor material", Circuitree, March.
5. Fjeldsted, K. (2003), "Trimming embedded resistors: third party processing", Proceedings of IPC Conference on Embedded Passives, Northbrook, IL, June.
6. Funer, R. (2002), "Embedding resistors and capacitors", Printed Circuit Design, December, p. 8.
7. Mabboux, P., Brodt, M., Go, B. and Wake, J. (2003), "System considerations in production environment for laser trimming of embedded passive components", Proceedings of IPC Conference on Embedded Passives, Northbrook, IL, June.
8. Palesko, C. (2003), "Activity based cost modeling for embedded passives", Proceedings of IPC Conference on Embedded Passives, Northbrook, IL, June.
9. Sandborn, P., Etienne, B., Herrmann, J. and Chincholkar, M. (2003), "Cost and production analysis for substrates with embedded passives", Circuit World, Vol. 30 No. 1, p. 25.
10. Savic, J., Croswell, R., Tungare, A., Dunn, G., Tang, T., Lempkowski, R., Zhang, M. and Lee, T. (2002), "Embedded passives technology implementation in RF applications", Circuitree, p. 10.
11. Snogren, R. (2003), "Paying to spend less", Printed Circuit Design and Manufacturing, December, p. 35.
12. Ulrich, R.K. and Schaper, L.W. (2003), Integrated Passive Component Technology, IEEE Press, Wiley Publication.