TDDB kinetics and their relationship with the E- and √E-models

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 168-170

  Yiang, Kok Yong ^a   Yao, H Walter ^a   Marathe, Amit ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

E model; BEOL; E model; Time dependent Dielectric Breakdown (TDDB)

Indexed keywords

BEOL; E-MODEL; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB);

ACTIVATION ENERGY;

EID: 50949117384     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546957     Document Type: Conference Paper

References (7)

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3. Zs. Tökei et al., "Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects," Proceedings of the IRPS, 2004, pp. 326-332.
4. J. R. Lloyd, E. Liniger, and T. M. Shaw, "Simple model for time-dependent dielectric breakdown in inter- and intralevel low-k dielectric," J. Appl. Phys. Vol. 98, Issue 8, 2005, pp. 084109-084109-6.
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