Progress, opportunities and challenges in modeling of plasma etching

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 90-92

  Yang, Yang ^a   Wang, Mingmei ^a   Kushner, Mark J ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS;

INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; MODELING AND SIMULATION; PLASMA ETCHING PROCESSES;

ETCHING;

EID: 50949112554     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546934     Document Type: Conference Paper

References (6)

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3. M. J. Kushner, J. Appl. Phys. 94, 1436 (2003).
4. A. Sankaran and M. J. Kushner J. Appl. Phys. 97, 023307 (2005).
5. G. A. Hebner, E. V. Barnat, P. A. Miller, A. M. Paterson and J. P. Holland, Plasma Source Sci. Technol. 15, 879 (2006).
6. Tokyo Electron, Ltd., http://www.tel.com