Estimation of the thermal fatigue resistance and creep properties of the Co/Ni-bearing SAC305 lead-free solders by the strain rate change tensile test

Materials Transactions

Volumn 49, Issue 7, 2008, Pages 1503-1507

  Cheng, Fangjie ^a,b   Nishikawa, Hiroshi ^b   Takemoto, Tadashi ^b  

^a TIANJIN UNIVERSITY   (China)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Creep properties; Lead free solder; Strain rate change tensile test; Thermal fatigue resistance

Indexed keywords

BEARINGS (STRUCTURAL); CREEP; METALLIC COMPOUNDS; TENSILE TESTING;

CREEP PROPERTIES; LEAD-FREE SOLDER; STRAIN RATE CHANGE TENSILE TEST; THERMAL FATIGUE RESISTANCE;

STRAIN RATE;

EID: 50549084483     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MF200803     Document Type: Article

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