SCOPUS 정보 검색 플랫폼

Reviews on Advanced Materials Science

Volumn 5, Issue 5, 2003, Pages 510-513

Crystallization and failure behaviors of Ta-Co nanostructured/amorphous diffusion barriers for copper metallization

(4) Fang, J S a Chang, H L b Chen, G S c Lee, P Y d

a NATIONAL FORMOSA UNIVERSITY (Taiwan)

b NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

c FENG CHIA UNIVERSITY (Taiwan)

d NATIONAL TAIWAN OCEAN UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; COBALT; COPPER; CRYSTALLIZATION; DIFFUSION; METALLIZING; PROBES; SILICON; STRUCTURE (COMPOSITION); TANTALUM; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

COPPER METALLIZATION; DIFFUSION BARRIERS; FAILURE BEHAVIOR; THIN FILM PROPERTIES;

NANOSTRUCTURED MATERIALS;

EID: 5044244934 PISSN: 16065131 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (6)

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