A fast and high-capacity electromagnetic solution for high-speed IC design

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn , Issue , 2007, Pages 1-6

  Gan, Houle ^a   Jiao, Dan ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Electromagnetics; Finite element method; High capacity; IC; Modeling; Simulation; Time domain

Indexed keywords

COMPUTER-AIDED DESIGN; ELECTROMAGNETICS; HIGH CAPACITY; HIGH FREQUENCIES; HIGH SPEEDS; IC; IC DESIGNS; IMPROVED PERFORMANCE; INTERNATIONAL CONFERENCES; LAYERED FINITE ELEMENTS; MATRIX REDUCTION; MEMORY COST; MEMORY OVERHEADS; MODELING; MULTI-LAYER STRUCTURES; MULTI-LAYER SYSTEMS; ON-CHIP CIRCUITS; ORIGINAL PROBLEM; SIMULATION; SINGLE LAYERS; SPARSE MATRICES; TIME DOMAIN; TIME DOMAINS;

DATA STORAGE EQUIPMENT; DESIGN; ELECTROMAGNETISM; FINITE ELEMENT METHOD; METHOD OF MOMENTS; MULTILAYERS; SOLUTIONS;

MATRIX ALGEBRA;

EID: 50249157605     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2007.4397235     Document Type: Conference Paper

References (14)

1. M. J. Kobrinsky, S. Chakravarty, D. Jiao, M. C. Harmes, S. List, and M. Mazumder, "Experimental Validation of Crosstalk Simulations for On-Chip Interconnects Using SParameters," IEEE Transactions on Advanced Packaging, Vol. 28, Issue 1, pp. 57-62, Feb. 2005.
2. D. Jiao, C. Dai, S.-W. Lee, T. R Arabi, and G. Taylor, "Computational Electromagnetics for High-Frequency IC Design," invited paper, 2004 IEEE International Symposium on Antennas and Propagation, pp. 3317-3320.
3. P. J. Restle, A. E. Ruehli, S. G. Walker, and G. Papadopoulos, 'Full-wave PEEC time-domain method for the modeling of on-chip interconnects," IEEE Trans. CAD, vol. 20, no. 7, July 2001, pp. 877-887.
4. A. Rong, A. C. Cangellaris, and L. Dong, "Comprehensive broadband electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model," IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), 2003, pp. 367-370.
5. Z. H. Zhu, B. Song, and J. K. White, "Algorithms in FastImp: A fast and wideband impedance extraction program for complicated 3D geometries," IEEE Trans. CAD, vol. 24, no. 7, July 2005, pp. 981-998.
6. D. Jiao, M. Mazumder, et. al, "A novel technique for fullwave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures," International Conference on Simu. of Semicond. Proc. and Dev., 2003, pp. 39-42.
7. S. Kapur and D. E. Long, "Large-Scale Full-wave Simulation," DAC 2004.
8. D. Gope, A. E. Ruehli, C. Yang, and V. Jandhyala, "(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic Simulations," IEEE Trans. on MTT, vol. 54, no. 6, June 2006, pp. 2453-2464.
9. Z. G. Qian, J. Xiong, L. Sun, I. T. Chiang, W.C. Chew, L. J. Jiang, Y. H. Chu, "Crosstalk Analysis by Fast Computational Algorithms," IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 367-370, 2005.
10. F. Ling, V. I. Okhamtovski, W. Harris, S. McCracken, and A. Dengi, "Large-scale broad-band parasitic extraction for fast layout verification of 3D RF and mixed-signal on-chip structures," IEEE Trans. on Microwave. Theory Tech., vol. 53, no. 1, pp. 264-273, Jan. 2005.
11. D. Jiao, S. Chakravarty, and C. Dai, "A layered finite-element method for high-capacity electromagnetic analysis of high-frequency ICs," IEEE Trans. Antennas Propagat., vol. 55, no. 2, pp. 422-432, Feb. 2007.
12. D. Jiao and J. M. Jin, "Finite element analysis in time domain," in The Finite Element Method in Electromagnetics, New York: John Wiley & Sons, 2002, pp. 529-584.
13. R. D. Graglia, D. R. Wilton, et. al, "Higher order interpolatory vector bases on prism elements," IEEE Trans. Antennas Propagat., vol. 46, no. 3, pp. 442-450, March 1998.
14. http://www.cise.ufl.edu/research/sparse/umfpack.