A layered finite element method for electromagnetic analysis of large-scale high-frequency integrated circuits

IEEE Transactions on Antennas and Propagation

Volumn 55, Issue 2, 2007, Pages 422-432

  Jiao, Dan ^a   Chakravarty, Sourav ^b   Dai, Changhong ^b  

^a PURDUE UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Electromagnetics; Finite element method; High capacity; High frequency; On chip circuits; Three dimension

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC FIELD THEORY; FINITE ELEMENT METHOD; LARGE SCALE SYSTEMS; MATHEMATICAL MODELS;

ELECTROMAGNETICS; LOGARITHMIC COMPLEXITY; ON-CHIP CIRCUITS;

INTEGRATED CIRCUITS;

EID: 33947403212     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2006.889847     Document Type: Article

References (18)

1. M. J. Kobrinsky, S. Chakravarty, D. Jiao, M. C. Harmes, S. List, and M. Mazumder, "Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters," IEEE Trans. Advanced Packaging, vol. 28, no. 1, pp. 57-62, Feb. 2005, [see also IEEE Trans. Compon., Packaging and Manufacturing Technol., Part B: Advanced Packaging].
2. D. Jiao, M. Mazumder, S. Chakravarty, C. Dai, M. J. Kobrinsky, M. C. Harmes, and S. List, "A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures," in Proc. Int. Conf. Simulation of Semiconductor Processes and Devices, Sep. 3-5, 2003, pp. 39-42.
3. D. Jiao, C. Dai, S.-W. Lee, T. R. Arabi, and G. Taylor, "Computational electromagnetics for high-frequency IC design," in Proc. IEEE Int. Symp. Antennas and Propagation Transl.:iNvited paper, 2004, pp. 3317-3320.
4. D. Gope and V. Jandhyala, "PILOT: A fast algorithm for enhanced 3-D parasitic extraction efficiency," in Proc. IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), 2003, pp. 337-340.
5. Z. H. Zhu, B. Song, and J. K. White, "Algorithm in fastimp: A fast and wideband impedance extraction program for complicated 3-D geometries," in Proc. 40th ACM/IEEE Design Automation Conf., 2003, pp. 712-717.
6. A. C. Cangellaris, "Towards full-chip Analysis with Electromagnetic Accuracy," presented at the IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), 2003.
7. L. Daiel, A. Sangiovanni-Vincentelli, and J. White, "Using conduction modes basis functions for efficient electromagnetic analysis of on-chip and off-chip interconnects," Proc. DAC, pp. 563-566, 2001.
8. A. Rong, A. C. Cangellaris, and L. Dong, "Comprehensive broadband electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model," in Proc. IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), 2003, pp. 367-370.
9. A. E. Yilmaz, J. M. Jin, and E. Michielssen, "A parallel FFT-accelerated transient field-circuit simulator," IEEE Trans. MTT, vol. 53, pp. 2851-2865, Sep. 2005.
10. S. Kapur and D. E. Long, "Large-scale full-wave simulation," DAC, pp. 806-809, 2004.
11. W. C. Chew, "Toward a more robust and accurate fast integral solver for microchip applications," in Proc. IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), 2003, p. 333.
12. D. Lukashevich, A. C. Cangellaris, and P. Russer, "Broadband electromagnetic analysis of interconnects by means of TLM and Krylov model order reduction," in Proc. IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005, pp. 355-358.
13. Z. G. Qian, J. Xiong, L. Sun, I. T. Chiang, W. C. Chew, L. J. Jiang, and Y. H. Chu, "Crosstalk analysis by fast computational algorithms," in Proc. IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005, pp. 367-370.
14. J. M. Jin, The Finite Element Method in Electromagnetics, 1st ed. New York: Wiley, 1993.
15. R. D. Graglia, D. R. Wilton, A. F. Peterson, and I. Gheorma, "Higher order interpolatory vector bases on prism elements," IEEE Trans. Antennas Propag., vol. 46, no. 3, pp. 442-450, Mar. 1998.
16. D. Jiao, S. Chakravarty, C. Dai, and S. W. Lee, "Surface-based finite element method for large-scale 3-D circuit modeling," in Proc. 14th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 24-26, 2005, pp. 347-350.
17. C. S. Desai and J. F. Abel, Introduction to the Finite Element Method. New York: Van Nostrand Reinhold, 1972.
18. J. Liu and J. M. Jin, "A special higher-order finite element method for scattering by deep cavities," IEEE Trans. Antennas Propog., vol. 48, pp. 694-703, May 2000.