A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn 2003-January, Issue , 2003, Pages 39-42

  Jiao, D ^a   Mazumder, M ^a   Chakravarty, S ^a   Dai, C ^a   Kobrinsky, M J ^a   Harmes, M C ^a   List, S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Anisotropic magnetoresistance; Conducting materials; Dielectric losses; Dielectric materials; Dispersion; Eigenvalues and eigenfunctions; Integrated circuit interconnections; Large scale systems; Scattering parameters; Solid modeling

Indexed keywords

ANISOTROPIC MEDIA; ANISOTROPY; DIELECTRIC DEVICES; DIELECTRIC LOSSES; DISPERSION (WAVES); DISPERSIONS; EIGENVALUES AND EIGENFUNCTIONS; ENHANCED MAGNETORESISTANCE; INTEGRATED CIRCUIT INTERCONNECTS; LARGE SCALE SYSTEMS; SCATTERING PARAMETERS; SEMICONDUCTOR DEVICES; WAVE PROPAGATION;

CHARACTERISTIC IMPEDANCE; CONDUCTING MATERIALS; GENERALIZED EIGENVALUE PROBLEMS; HIGH SPEED INTERCONNECT; INTEGRATED CIRCUIT INTERCONNECTIONS; MODE MATCHING TECHNIQUE; SOLID MODEL; WAVE PROPAGATION PROBLEMS;

DIELECTRIC MATERIALS;

EID: 4544339277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SISPAD.2003.1233632     Document Type: Conference Paper

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