(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic Simulations

IEEE Transactions on Microwave Theory and Techniques

Volumn 54, Issue 6, 2006, Pages 2453-2464

  Gope, Dipanjan ^a,b   Ruehli, Albert E ^c   Yang, Chuanyi ^a   Jandhyala, Vikram ^a  

^a UNIVERSITY OF WASHINGTON   (United States)

^b INTEL CORPORATION   (United States)

^c IBM RESEARCH   (United States)

Author keywords

Circuit electromagnetic (circuit EM); integral equation; partial element equivalent circuit (PEEC); PMCHWT

Indexed keywords

EID: 85008025103     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/TMTT.2006.875796     Document Type: Article

References (30)

1. K. Kundert, H. Chang, D. Jefferies, G. Lamant, E. Malavasi, and F. Sendig, “Design of mixed-signal systems-on-a-chip,” IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol. 19, no. 12, pp. 1561–1571, Dec. 2000.
2. N. K. Verghese, T. J. Schmerbech, and D. J. Allstot, Simulation Techniques and Solutions for Mixed-Signal Coupling in Intergrated Circuits. Norwell, MA: Kluwer, 1995, p. 160.
3. C. Christopoulos, The Transmission-Line Modeling Method: TLM. Piscataway, NJ: IEEE Press, 1995.
4. S. Chun, M. Swaminathan, L. D. Smith, J. Srinivasan, Z. Jin, and M. K. Iyer, “Modeling of simultaneous switching noise in high speed systems,” IEEE Trans. Adv. Packag., vol. 24, no. 2, pp. 132–142, May 2001.
5. I. Erdin and M. Nakhla, “Mixed circuit/electromagnetic analysis of field coupling to high speed interconnects in inhomogeneous medium,” in Proc. IEEE Int. Symp. Electromagn. Compat., Aug. 1999, vol. 1, pp. 446–449.
6. W. Sui, D. A. Christensen, and C. H. Durney, “Extending the two-dimensional FDTD method to hybrid electromagnetic systems with active and passive lumped elements,” IEEE Trans. Microw. Theory Tech., vol. 40, no. 4, pp. 724–730, Apr. 1992.
7. M. N. Abdullaa and M. B. Steer, “Extraction of network parameters in the electromagnetic analysis of planar structures using the method of moments,” IEEE Trans. Microw. Theory Tech., vol. 49, no. 1, pp. 94–103, Jan. 2001.
8. J. M. Jin, The Finite Element Method in Electromagnetics. New York, NY: Wiley, 1993.
9. A. Canova, M. Ottella, and D. Rodger, “A coupled field-circuit approach to 3D FEM analysis of electromechanical devices,” in Proc. IEEE 9th Int. Conf. Electrical Mach. Drive, Sep. 1999, pp. 71–75.
10. M. Feliziani and F. Maradei, “Circuit-oriented FEM: Solution of circuit-field coupled problems by circuit equations,” IEEE Trans. Magn., vol. 38, no. 2, pp. 965–968, Mar. 2002.
11. M. C. Costa, S. I. Nabeta, and J. R. Cardoso, “Modified nodal analysis applied to electric circuits coupled with FEM in the simulation of a universal motor,” IEEE Trans. Magn., vol. 36, no. 4, pp. 1431–1434, Jul. 2000.
12. A. E. Ruehli, “Equivalent circuit models for three-dimensional multiconductor systems,” IEEE Trans. Microw. Theory Tech., vol. MTT22, no. 3, pp. 216–221, Mar. 1974.
13. A. E. Ruehli, G. Antonini, J. Esch, J. Ekman, A. Mayo, and A. Orlandi, “Nonorthogonal PEEC formulation for time and frequency-domain EM and circuit modeling,” IEEE Trans. Electromagn. Compat., vol. 45, no. 2, pp. 167–176, May 2003.
14. A. Rong, A. C. Cangellaris, and L. Dong, “Comprehensive broadband electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model,” in Proc. IEEE Elec. Perf. Electron. Packaging Conf, Oct. 2003, pp. 367–370.
15. Y. Wang, V. Jandhyala, and C. J. Shi, “Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures,” in Proc. Electrical Performance Electron. Packag. Conf, Boston, MA, Oct. 2001, vol. 10, pp. 233–236.
16. Y. Wang, D. Gope, V. Jandhyala, and C. J. R. Shi, “Integral equation-based coupled electromagnetic-circuit simulation in the frequency domain,” in Proc. IEEE APS-URSI Ohio, Jun. 2003, vol. 3, pp. 328–331.
17. D. Gope, A. Ruehli, and V. Jandhyala, “Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations,” in Dig. IEEE Electr. Perf. Electronic Packaging, Portland, OR, Oct. 2004, vol. 13, pp. 329–332.
18. A. F. Peterson, S. L. Ray, and R. Mittra, “Computational methods for electromagnetics,” in IEEE/Oxford Univ. Press Series on Electromagnetic Wave Theory. Oxford, U.K.: Oxford Univ. Press, 1998.
19. A. Poggio and E. Miller, “Integral equation solutions for three dimensional scattering problems,” in Computer Techniques for Electromagnetics, R. Mittra, Ed. New York, NY: Pergamon, 1973, ch. 4.
20. K. Umashankar, A. Taflove, and S. Rao, “Electromagnetic scattering by arbitrary shaped three-dimensional homogeneous lossy dielectric objects,” IEEE Trans. Antennas Propag., vol. 34, no. 6, pp. 758–766, Jun. 1986.
21. B. M. Kolundzija, “Electromagnetic modeling of composite metallic and dielectric structures,” IEEE Trans. Microw. Theory Tech., vol. 47, no. 7, pp. 1021–1032, Jul. 1999.
22. C. T. Tai, Generalized Vector and Dyadic Analysis. New York, NY: IEEE Press, 1992.
23. S. Chakraborty and V. Jandhyala, “Evaluation of Green's function integrals in conducting media,” in Proc. IEEE Antennas Propag. Symp., Columbus, OH, Jun. 2003, vol. 3, pp. 320–323.
24. W. C. Chew, Waves and Fields in Inhomogeneous Media. New York, NY: IEEE Press, 1995.
25. B. M. Kolundzija and V. V. Petrovic, “Comparison of MoM/SIE, MoM/VIE and FEM based on topological analysis of two canonical problems,” in Proc. IEEE AP-S Int. Symp, Atlanta, GA, 1998, pp. 274–277.
26. G. Antonini, A. Orlandi, and A. E. Ruehli, “Harten's scheme for PEEC method,” in Proc. IEEE Int. Symp. Electromagn. Compat., Aug. 2001, vol. 1, pp. 340–344.
27. M. Kamon, M. J. Ttsuk, and J. K. White, “Algorithms in Fastlmp: A fast and wide-band impedance extraction program for complicated 3-D geometries,” IEEE Trans. Comput.-AidedDesign Integr. Circuits Syst., vol. 24, no. 7, pp. 981–998, Jul. 2005.
28. 3: A fast integral equation solver for efficient 3-dimensional extraction,” in IEEE/ACM Int. Conf. Comput.-Aided Design Dig., Nov. 1997, pp. 448–455.
29. A. Ruehli, D. Gope, and V. Jandhyala, “Block partitioned Gauss-Seidel PEEC solver accelerated by QR-based coupling matrix compression techniques,” in Dig. IEEE Electr. Perf. Electron. Packag., Portland, OR, Oct. 2004, vol. 13, pp. 325–328.
30. A. E. Yilmaz, J.-M. Jin, and E. Michielssen, “A parallel FFT accelerated transient field-circuit simulator,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2851–2865, Sep. 2005.