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Volumn , Issue , 2006, Pages

RF CMOS-MEMS switch with low-voltage operation for single-chip RF LSIs

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRIC SWITCHES; ELECTRON DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MEMS; MICROELECTROMECHANICAL DEVICES; OPTICAL DESIGN; THICK FILMS;

EID: 46049091598     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2006.346891     Document Type: Conference Paper
Times cited : (21)

References (7)
  • 1
    • 0032137442 scopus 로고    scopus 로고
    • Micromachined devices for wireless communications
    • Aug
    • C. T.-C. Nguyen, L. P. B. Katehi, and G. M. Rebeiz, "Micromachined devices for wireless communications," Proc. IEEE, vol. 86, no. 8, pp. 1756-1768, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , Issue.8 , pp. 1756-1768
    • Nguyen, C.T.-C.1    Katehi, L.P.B.2    Rebeiz, G.M.3
  • 2
    • 14844298187 scopus 로고    scopus 로고
    • RF CMOS comes of age
    • Apr
    • A. A. Abidi, "RF CMOS comes of age," IEEE J. Solid-State Circuits, vol. 39, no. 4, pp. 549-561, Apr. 2004.
    • (2004) IEEE J. Solid-State Circuits , vol.39 , Issue.4 , pp. 549-561
    • Abidi, A.A.1
  • 6
    • 0001563141 scopus 로고    scopus 로고
    • Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing
    • K. Machida, H. Kyuragi, H. Akiya, K. Imai, A. Tounai, and A. Nakashima, "Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing," J. Vac. Sci. Technol., vol. B 16, pp. 1093-1097, 1998.
    • (1998) J. Vac. Sci. Technol , vol.B 16 , pp. 1093-1097
    • Machida, K.1    Kyuragi, H.2    Akiya, H.3    Imai, K.4    Tounai, A.5    Nakashima, A.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.