Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1253-1257

  Jacob, Peter ^a   Rothkirch, Werner ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b NXP SEMICONDUCTORS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANISMS; OFFSHORE OIL WELL PRODUCTION; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR; SAWING; SURFACE CLEANING; ULTRASONIC CLEANING;

EEPROM MEMORY; FAILURE MECHANISMS; ROOT CAUSES; WAFER SAWING; WATER DROPS;

FAILURE ANALYSIS;

EID: 50249086394     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.06.040     Document Type: Article

References (9)

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2. Weisshaus I, Shi D, Efrat U. Wafer dicing. Advanced packaging, issued January; 2000. p. 60-3.
3. Jacob P., and Reiner J.C. Assembly processes - a surface electrostatic discharge killer for devices and a FA challenge. ASM-EDFAS, Electron Dev Failure Anal 7 2 (2005) 6-12
4. Jacob P, Hartfield, C. Tool-related ESD surface damage (ESDFOS) on wafers in Cu-technology. In: ISTFA 2007, proceedings of 33rd international symposium for testing and failures analysis, San José, USA. November 4-8; 2007.
5. Wilbert J. Der Kelvin-Generator als Demonstrationsexperiment zur Elektrostatik. Zulassungsarbeit zum Ersten Staatsexamen für das Lehramt an Gymnasien, Physikal Inst der Universität Erlangen-Nürnberg, März; 1997.
6. 2-bubbling (carbonation) a requirement at semiconductor wafer sawing process. In: ESDA 2006 conference.
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8. Murray F. Silicon based system-in-package and passive integration: a breakthrough in the improvement of system level reliability [invited paper IP7 in session F of ESREF 2007, not included in proceedings, publication of NXP Caen].
9. Jacob P., and Reiner J.C. Electrostatic effects on semiconductor tools. Proceedings of ESREF 2004. Microelectron Reliab 44 (2004) 1787-1792