Tool-related ESD surface damage (ESDFOS) on wafers in Cu-technology

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2007, Pages 262-269

  Jacob, Peter ^a   Hartfield, Cheryl ^b,c  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b TEXAS INSTRUMENTS   (United States)

^c Omniprobe Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM METALLIZATION; DAMAGE FEATURES; ELECTROSTATIC DISCHARGE FROM OUTSIDE TO SURFACE; INTERNATIONAL SYMPOSIUM; MECHANICAL DAMAGES; PHYSICAL FEATURES; SURFACE DAMAGES;

ALUMINA; COPPER; COPPER ALLOYS; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; ELECTROSTATICS; LIGHT METALS; METALLIZING; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR;

FAILURE ANALYSIS;

EID: 49649122859     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Jacob, P., Reiner, J.C., "Assembly Processes - a Surface Electrostatic Discharge Killer for Devices and a FA Challenge", ASM-EDFAS, "Electronic device failure analysis". 2005, vol. 7, issue 2, pp.6-12
2. Jacob, P., Reiner J.C., "Electrostatic Effects on Semiconductor Tools", Transactions on Device and Microelectronics Reliability 44, 2004, pp. 1787-1792
3. Jacob, P., Nicoletti, G., "Manufacturing-Robotic-Induced "Mechanical Damages" on Semiconductor Dies: Mechanics, Electrostatics or What Else ?", 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2005, June 27-July 1, 2005 Singapore, IEEE Catalogue No 05TH8827,pp.307-312
4. Jacob, P., Nicoletti, G., "Surface Electrostatic Damage by Micro-Process Robotic Machines: Diagnosis and Reliability, Process-Auditing and Remedies", Transactions on Device and Materials Reliability, IEEE Transactions on Device and Materials Reliability, Vol. 6, No.2, June 2006, p. 213-220