Electrostatic effects on semiconductor tools

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1787-1792

  Jacob, P ^a,b   Reiner, J C ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EM Microelectronic   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSIONS; CAPACITANCE; ELECTRIC BREAKDOWN; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; ELECTRIC POTENTIAL; ELECTRODES; ELECTROSTATICS; ION BEAMS; PARAMETER ESTIMATION; PASSIVATION; PERMITTIVITY;

ELECTROSTATIC DISCHARGE FROM OUTSIDE-TO-SURFACE (ESDFOS); LATENCY RISKS; MECHANICAL DAMAGES; POLARITY;

SEMICONDUCTOR MATERIALS;

EID: 4544244275     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.107     Document Type: Conference Paper

References (5)

1. P. Jacob, U. Thiemann, J. Reiner, Electrostatic Discharge Directly to the Chip Surface, Caused by Automatic Post-Wafer Processing, t. b. published in Journal of Microelectronics Reliability, 2004 (review in process)
2. Funkenschlagweiten in Abhängigkeit von der Spannung an einer Kugelfunkenstrecke, Java-Programm unter www.hrcs.at/influenz.htm
3. Günter Lüttgens und Mitautoren, "Expert Praxislexikon Statische Elektrizität", S.178, Expert-Verlag 2000, ISBN 3-8169-1486-1
4. Günter Lüttgens und Mitautoren, "Statische Elektrizität", S. 237, 4. Aufl. 2002, ISBN 3-8169-1836-0
5. Hdbk. of Chem. & Phys., 72st Ed., David R. Lide, 1991-1992