Dicing advanced materials for microelectronics

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 149-152

  Cheung, Annette Teng ^a  

^a CORWIL Technology Corp ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDED WAFERS; BUMPED SILICON WAFERS; THINNED SILICON; ULTRATHIN SILICON WAFERS;

CAVITATION; LASER APPLICATIONS; MARKETING; MICROELECTRONIC PROCESSING; SILICON WAFERS; THIN FILMS;

MICROELECTRONICS;

EID: 33746567877     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432066     Document Type: Conference Paper

References (3)

1. I. Weisshaus, D. Shi and U. Efrat, "Wafer Dicing," Advanced Packaging, Jan. 2000, pp 60-63
2. M. Gerber and N. Arguello, "A Comparison between Single Versus Dual Spindle Processes for Copper Metallized Wafers," Proceedings of Electronic Components and Technology Conference, San Diego, CA, May 2002, pp. 1167-1171.
3. Military Standard 883, Method 2010, "Internal Visual".