A novel double-side CMOS-MEMS post processing for monolithic sensor integration

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 90-93

  Sun, Chih Ming ^a   Wang, Chuanwei ^a   Tsai, Ming Han ^a   Hsie, H Shen ^b   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b DELTA ELECTRONICS INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; COMPOSITE MICROMECHANICS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MONOLITHIC INTEGRATED CIRCUITS; PRESSURE SENSORS; PRESSURE TRANSDUCERS; REACTIVE ION ETCHING;

CMOS SENSORS; CMOS-MEMS; INTERNATIONAL CONFERENCES; MEASUREMENT RESULTS; MICRO-ELECTRO MECHANICAL SYSTEMS; NON LINEARITIES; POST PROCESSING; SENSOR INTEGRATIONS; SINGLE CHIPS;

SENSORS;

EID: 50149114135     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443600     Document Type: Conference Paper

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