Functional embedded RF circuits on multi-layer Printed Wiring Board (PWB) process

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1634-1641

  Jow, Uei Ming ^a   Lai, Ying Jiunn ^a   Weng, Ching Liang ^a   Chen, Chang Sheng ^a   Shyu, Chin Sun ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; MICROPROCESSOR CHIPS; PRODUCT DEVELOPMENT; SUBSTRATES;

BLUETOOTH; ELECTRONIC PRODUCT; INTEGRAL SUBSTRATE; SYSTEM IN PACKAGE (SIP); SYSTEM ON A CHIP (SOC);

MULTILAYERS;

EID: 24644480276     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2005.1442010     Document Type: Conference Paper

References (10)

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