Electrical characterization of multilayered thin film integral passive devices

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 240-246

  Morcan, G ^a   Lenihan, T ^a,b   Parkerson, J P ^a   Schaper, L ^a   Ang, S ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

^b Sheldahl Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHIP SCALE PACKAGES; MICROELECTRONICS; MINIATURE INSTRUMENTS; NETWORK COMPONENTS; PERSONAL DIGITAL ASSISTANTS; PRINTED CIRCUIT DESIGN; SURFACE MOUNT TECHNOLOGY; THIN FILM CIRCUITS; THIN FILMS; CAPACITORS; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; MULTILAYERS; POLYIMIDES; RESISTORS; SUBSTRATES; THIN FILM DEVICES;

APPLICATION DEVELOPMENT; ELECTRICAL CHARACTERIZATION; FREQUENCY DEPENDENT CHARACTERISTICS; HIGH DENSITY INTERCONNECTS; HIGH-FREQUENCY APPLICATIONS; MICROELECTRONIC PACKAGING; MULTILAYERED THIN FILMS; PASSIVE INTEGRATION TECHNOLOGY;

SUBSTRATES; PASSIVE NETWORKS;

MULTILAYERED THIN FILM INTEGRAL PASSIVE DEVICES;

EID: 0031625573     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678700     Document Type: Conference Paper

References (6)

1. G. Morcan, K. Fairchild, T. Lenihan, W. Brown, L. Schaper, S. Ang, W. Sommers, J. Parkerson, M. Glover, "Reliability of Flexible Thin Film Embedded Resistors and Electrical Characterization of Thin Film Embedded Capacitors and Inductors", Proceedings of the 4Th Electronic Components and Technology Conference, 1997, pp. 730-738.
2. R. Frye, "Passive components in Electronic Applications: Requirements and Prospects for Integration", The International Journal of Microcircuits and Electronic Packaging, V. 19, No. 4, 1996, pp. 483-490.
3. J. Parkerson, T. Lenihan, L. Schaper, G. Morcan, "Product Desing using Integrated Passive Components" Second International Conference on Flex Circuits, 9/96.
4. G. Gengel, "A Process for the Manufacture of Cost Competitive MCM Substrates, " Multichip Module Conference, 1994, pp. 182-187.
5. T. Lenihan, L. Schaper, Y. Shi, G. Morcan, K. Fairchild, J. Parkerson, "Embedded Thin Film Resistors, Capacitors and Inductors in Flexible Polyimide Films", Proceedings of the 46th Electronic Components and Technology Conference, 1996, pp. 119-124.
6. L. Schaper, R. Ulrich, D. Nelms, E. Porter, T. Lenihan, C. Wan, "The Stealth Decoupling Capacitor", Proceedings of the 47th Electronic Components and Technology Conference, 1997, pp. 724-729.