Design consideration for system-in-a-package with embedded passive circuits

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1678-1681

  Lee, Gye An ^a   Megahed, Mohamed ^b   De Flaviis, Franco ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b SKYWORKS SOLUTIONS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; EMBEDDED SYSTEMS; FREQUENCIES; HEAT RADIATION; HIGH PASS FILTERS; LOW PASS FILTERS; MICROPROCESSOR CHIPS; POWER AMPLIFIERS;

CELLULAR SYSTEMS; DIPLEXERS; MULTI-CHIP MODULE (MCP); RADIO FREQUENCY;

PASSIVE NETWORKS;

EID: 10444280032     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Rodolfo Lucero, Wasiem Qutteneh, Anthony Pavio, David Meyers, and John Estes, "Design of an LTCC Switch Diplexer Front-end Module for GSM/DCS/PCS Applications," IEEE Radio Frequency Integrated Circuits Symposium, pp. 213-216, June, 2001.
2. Mohamed Megahed, Emmanuel Ngompe, Mark Avyazian, Michael Glasbrener, "Design considerations for single package radio/spl trade/ (SPR) solution for EGSM/DCS dual band cellular phones," Microwave Symposium Digest, pp. 1707-1710, June, 2003.
3. th topical meeting EPEP, pp. 83-86, Oct, 2003.
4. D. K. Schroder, Semiconductor Material and Device Characterization, New York: John Wiley & Sons, Inc. 1990.