Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 295-302

  Zoschke, K ^a   Wolf, J ^a   Ehrmann, O ^a   Toepper, M ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; CAPACITANCE; CAPACITORS; CHIP SCALE PACKAGES; COPPER; DIELECTRIC DEVICES; DIELECTRIC MATERIALS; ELECTRIC CURRENTS; ELECTRIC EQUIPMENT; ELECTRONICS PACKAGING; ENERGY STORAGE; GLASS; INTEGRATION; OPTICAL DESIGN; PAPER CAPACITORS; PASSIVE FILTERS; STANDARDIZATION; STANDARDS; TECHNOLOGY; THICK FILMS; THIN FILM DEVICES; THIN FILMS; WAVE FILTERS;

APPLICATION-SPECIFIC; BENZO-CYCLO-BUTENE; CAPACITANCE DENSITY; CAPACITOR DIELECTRICS; CHIP STRUCTURES; DIELECTRIC FEATURES; FILM SUBSTRATES; FLEXIBLE BASE; HIGH-QUALITY; INTEGRATED PASSIVE DEVICE; INTEGRATED PASSIVE DEVICES; INTEGRATED PASSIVES; LC FILTERS; LOW DIELECTRIC CONSTANT; MULTI LAYER CONSTRUCTION; MULTI LAYERING; NEW PROCESSES; NEW TECHNOLOGIES; PACKAGING TECHNOLOGIES; PASSIVE COMPONENTS; SIZE REDUCTIONS; WAFER-LEVEL INTEGRATION;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049108924     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469803     Document Type: Conference Paper

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