Integration of NiCr resistors in a multilayer Cu/BCB wiring system

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 178-185

  Scherpinski, K ^a,b   Topper, M ^a,b   Krause, F ^a,b   Halser, K ^a,b   Hahn, R ^a,b   Ehrmann, O ^a,b   Reichl, H ^a,b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b Department of Mechanical Reliability in Microtechnology   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CHIP SCALE PACKAGES; CHROMIUM ALLOYS; COPPER ALLOYS; COST REDUCTION; INTEGRATION; INTERFACES (MATERIALS); MULTILAYERS; PACKAGING MATERIALS; RESISTORS; SUBSTRATES; THERMAL AGING;

ASSEMBLY COSTS; ELECTRICAL RESISTANCES; ELECTRONIC INDUSTRIES; ELECTRONIC SYSTEMS; MULTILAYER BOARDS; RELIABILITY TEST; REPRODUCIBILITIES; WIRING SYSTEMS;

NICKEL ALLOYS;

EID: 85037160421     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757308     Document Type: Conference Paper

References (9)

1. E. A. Logan, C.-M. Lin , "Precision Embedded Passive Components for Multichip Module Substrates", Advancing Microelectronics, March/April 1997, p.26-29
2. P. E. Garrou, I. Turlik, "Multichip Module Technology Handbook", McGraw-Hill, 1998, USA
3. M. Toepper, M. Schaldach, H. Reichl, "Chip Size Package-The Option of Choice for Miniaturized Medical Devices", International Symposium on Microelectronics, 1998, USA
4. J. Lernout. A. Van Calster, G. Schols, "On the Effective Integration of Resistors and Capacitors into a MCM-Si Design", International Conference on Multichip Modules, Denver Co, USA, 17-19 April, 1996, p. 391-396
5. L. I. Maissel, R. Glang, "Handbook of Thin Film Technology", McGraw-Hill, 1970
6. L. B. Valdes, Proc. IRE, 42, p.420,1954
7. F. N. Sinnadurai, "Handbook of Microelectronics Packaging and Interconnection Technologies", Electrochemical Publications, 1985
8. M. Toepper, K. Scherpinski, R. Hahn, O. Ehrmann, H. Reichl, Ch. Schmaus, F. Bechthold, "Combination of MCM-C Technologie with MCM-D Technology using Photosensitive Polymers", 4th Intern. Symposium on Advanced Packaging Materials, Braserlton (USA), 1998
9. P. B. Chinoy, "Reactive Ion Etching of Benzocyclotene Polymer Films", IEEE Transactions on Components Packaging and Manufacturing Technology-Part C, Vol. 20, No. 3, July 1997