Thin film substrate technology and FC interconnection for very high frequency applications

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1338-1342

  Topper M ^a   Rosin, Th ^b   Fritzsch, Th ^a   Jordan, R ^a   Mekonnen, G ^b   Sakkas, C ^b   Kunkel, R ^b   Scherpinski, K ^a   Schmidt, D ^b   Oppermann, H ^a   Dietrich, L ^a   Beling, A ^b   Eckhardt, Th ^b   Bach, H G ^b   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL TESTS; HIGH FREQUENCY MEASUREMENT SYSTEMS; SUBSTRATE TECHNOLOGY; THIN FILM SUBSTRATES;

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; MICROSTRIP LINES; PHOTODETECTORS; SUBSTRATES;

THIN FILM DEVICES;

EID: 33845595106     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645829     Document Type: Conference Paper

References (15)

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