Microstructure of interface for high-adhesion DLC film on metal substrates by plasma-based ion implantation

Vacuum

Volumn 83, Issue 1, 2008, Pages 190-197

  Yatsuzuka, Mitsuyasu ^a   Oka, Yoshihiro ^a   Nishijima, Masahiko ^b   Hiraga, Kenji ^b  

^a UNIVERSITY OF HYOGO   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Diamond like carbon (DLC); High adhesion; Microstructure; Nano interface; Plasma based ion implantation and deposition (PBIID); Stress free DLC; Supra thick film; TEM observation

Indexed keywords

ADHESION; AMORPHOUS CARBON; BOND STRENGTH (MATERIALS); CARBON; DIAMOND FILMS; DIAMONDS; ELECTRIC LOAD MANAGEMENT; ELECTROLYSIS; EPOXY RESINS; INORGANIC COATINGS; ION BEAM ASSISTED DEPOSITION; ION BOMBARDMENT; ION IMPLANTATION; IONS; METALS; MICROSTRUCTURE; MOLECULAR BEAM EPITAXY; NONMETALS; PAINTING; PHASE INTERFACES; PLASMA DEPOSITION; PLASMAS; RESINS; SILICON; SILICONES;

ADHESION STRENGTHS; ADHESIVE STRENGTHS; AMORPHOUS-LIKE; CARBON IONS; DIAMOND-LIKE CARBON; DIAMOND-LIKE CARBON (DLC); DLC FILMS; EDS ANALYSIS; HIGH VOLTAGE PULSING; HIGH-ADHESION; IMPLANTED REGION; METAL SUBSTRATES; MICROSTRUCTURE OF INTERFACE; NANO-INTERFACE; OXIDE LAYERS; PLASMA-BASED ION IMPLANTATION; PLASMA-BASED ION IMPLANTATION AND DEPOSITION (PBIID); RESIN STRENGTH; STRESS-FREE DLC; SUBSTRATE SURFACES; SUPRA-THICK FILM; TEM OBSERVATION; TOP SURFACE; TRANSMISSION ELECTRON MICROSCOPY (TEM);

SUBSTRATES;

EID: 49949099328     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2008.03.021     Document Type: Article

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