A digital-microfluidic approach to chip cooling

IEEE Design and Test of Computers

Volumn 25, Issue 4, 2008, Pages 372-391

  Paik, Philip Y ^a   Pamula, Vamsee K ^a   Chakrabarty, Krishnendu ^b  

^a ICx Biosystems ^*

^b Duke University   (United States)

Author keywords

Adaptive cooling platform; Chip cooling; Cooling; Digital microfluidics; Fluid flow; Fluidics; Heat removal; Microfluidics; Reconfigurability; Thermal management

Indexed keywords

DIGITAL ARITHMETIC; NANOFLUIDICS;

ADAPTIVE COOLING PLATFORM; ALTERNATIVE APPROACH; CHEMICAL-; CHIP COOLING; CIRCUIT PERFORMANCES; COOLING TECHNIQUES; DIE TEMPERATURES; DIGITAL MICROFLUIDICS; ELECTRO-WETTING; FLUID FLOW; FLUIDICS; HEAT REMOVAL; HOT SPOTTING; IC DESIGNS; LAB ON A CHIPS; MICRO-FLUIDIC; MICROFLUIDIC PLATFORMS; MICROFLUIDICS; MICROLITERS; NANOLITERS; NON UNIFORM; PHYSICAL STRESS; PICOLITERS; RE-CONFIGURABLE; RECONFIGURABILITY; THERMAL MANAGEMENT;

COOLING;

EID: 49549112678     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/MDT.2008.87     Document Type: Article

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