SiC power electronics packaging prognostics

IEEE Aerospace Conference Proceedings

Volumn , Issue , 2008, Pages

  Bower, Gregory ^a   Rogan, Chris ^a   Kozlowski, James ^a   Zugger, Michael ^b  

^a State College   (United States)

^b State College   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND WIRES; COFFIN-MANSON RELATIONSHIP; CURRENT GENERATION; ELECTRONIC PACKAGING; ENCAPSULANT; FAILURE MECHANISMS; FAILURE MODE AND EFFECTS ANALYSIS; FATIGUE FAILURES; HIGH POWER PACKAGING; HIGH PROBABILITY; HIGH TEMPERATURE; LIFE MODELING; LITERATURE SURVEYS; OPERATING TEMPERATURES; OPERATIONAL LIFE; P-D MODEL; PACKAGE DESIGNS; PACKAGING TECHNOLOGIES; PARTIAL DISCHARGE (PD); POTENTIAL FAILURE MODES; POWER ELECTRONICS PACKAGING; POWER LEVELING; POWER-ELECTRONIC DEVICES; SI-BASED; SOLDER JOINT FATIGUE;

ELECTRIC POWER SYSTEMS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FAILURE MODES; MECHANISMS; PARTIAL DISCHARGES; POWER ELECTRONICS; POWER GENERATION; QUALITY ASSURANCE; RELIABILITY ANALYSIS; RISK ASSESSMENT; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICES; SILICON; SILICON CARBIDE; STATISTICAL PROCESS CONTROL; SURVEYS; TECHNOLOGY;

RELIABILITY;

EID: 49349109487     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2008.4526605     Document Type: Conference Paper

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