Thermo-mechanical simulations for 4-layer stacked IC packages

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Hsieh, Ming Che ^a   Yu, Chih Kuang ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; ELECTRONICS INDUSTRY; EXPERIMENTS; FORMING; IMAGE SEGMENTATION; MICROELECTRONICS; NONMETALS; SILICON; STRESS CONCENTRATION; THERMOMECHANICAL TREATMENT;

COMPOSITE PARTS; DESIGN GUIDELINES; ELECTRICAL CHARACTERISTICS; HEAT DISSIPATION; IC PACKAGING; INDUCED STRESSES; INTERFACIAL DELAMINATION; INTERNATIONAL CONFERENCES; JUNCTION TEMPERATURES; MATE RIAL PROPERTIES; MECHANICAL PROBLEMS; MECHANICAL SIMULATIONS; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; ON CHIPS; RESPONSE SURFACE METHODOLOGY; STRESS DISTRIBUTIONS; TEST VEHICLES; THROUGH-SILICON VIAS; UNDERFILL; VON MISES STRESSES;

STRESSES;

EID: 49249105625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525007     Document Type: Conference Paper

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