|
|
|
Volumn , Issue , 1996, Pages 183-190
|
|
Development of JEDEC standard thermal measurement test boards
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
COMPONENTS;
COMPUTER SIMULATION;
HEAT SINKS;
INTEGRATED CIRCUITS;
METALLIC FILMS;
PRINTED CIRCUIT DESIGN;
PRINTED CIRCUIT TESTING;
SENSITIVITY ANALYSIS;
STANDARDS;
SURFACE MOUNT TECHNOLOGY;
THERMAL CONDUCTIVITY;
THERMODYNAMIC PROPERTIES;
AREA ARRAY PACKAGES;
BALL GRID ARRAYS;
MEASUREMENT VARIABILITY;
SURFACE MOUNTED COMPONENTS;
THERMAL MEASUREMENT TEST BOARDS;
ELECTRONICS PACKAGING;
|
|
EID: 0029705925
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (8)
|
|
References (14)
|
