DOE analysis of effects of geometry and materials on Cu/low-k interconnect stresses

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 95-99

  Hsieh, Ming Che ^a   Lee, Wei ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; ELECTRICAL CHARACTERISTICS; SURFACE METHODOLOGY; THERMAL-MECHANICAL EFFECTS;

DESIGN OF EXPERIMENTS; OPTIMIZATION; PARAMETER ESTIMATION; STRESS CONCENTRATION; THERMOMECHANICAL TREATMENT;

OPTICAL INTERCONNECTS;

EID: 40449086931     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33510     Document Type: Conference Paper

References (9)