MEMS, head, and packaging applications using through-mask Cu deposition

Solid State Technology

Volumn 47, Issue 10, 2004, Pages 57-63

  Kim, Bioh ^a   Ritzdorf, Tom ^a   Christian, Stephen ^b   Forman, Robert ^b  

^a Semitool Incorporated   (United States)

^b ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN-REFINING EFFECT; ORGANIC MIXTURES; TAPE-PULLING TEST; THROUGH-MASK ELECTRODEPOSITION;

ADDITIVES; ADHESION; COPPER; CURRENT DENSITY; DEFECTS; ELECTRODEPOSITION; ION BEAMS; SILICA; TITANIUM NITRIDE;

MICROELECTROMECHANICAL DEVICES;

EID: 8344230809     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (15)

1. L.T. Romankiw, P. Simon, IEEE Transactions on Magnetics, MAG-11, p. 50, 1975.
2. K.G. Ashar, Magnetic Disk Drive Technology, p. 129, IEEE Press, NY, 1997.
3. R.T. Howe, et al., IEEE Spectrum, p. 29, July 1990.
4. M. Pottenger, et al., "MEMS: The Maturing of a New Technology," Solid State Technology, p. 89, Sept. 1997.
5. D. Gardner, et al., Proc. IITC, p. 101, 2001.
6. C. Bermond, et al., Proc. IITC, p. 104, 2001.
7. G. Solomon, TAP Technology, p. 29, March 2001.
8. P.A. Magill, et al., HDI, p. 48, April 2000.
9. K. Hayashi, et al., J. Electrochem. Soc., 148 (3), p. C145, 2001.
10. B. Kim, T. Ritzdorf, J. Electrochem. Soc., 151 (5), p. C342, 2004.
11. B. Kim, et al., IMAPS-ATW, Final Program and Abstract Book, paper 14, 2003.
12. B. Kim, T. Ritzdorf, Chip Scale Review, 8 (2), p. 53, 2004.
13. V.R. Subramanian, R.E. White, J. Electrochem. Soc., 149 (10), p. C498, 2002.
14. K. Kondo, et al., J. Electrochem. Soc., 143 (6), p. 1880, 1996.
15. K. Kondo, et al., J. Electrochem. Soc., 144 (2), p. 466, 1997.