A package-process-oriented multilevel 5-μm-thick Cu wiring technology with pulse periodic reverse electroplating and photosensitive resin

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 189-191

  Kikuchi, K ^a   Takamiya, M ^a   Kudoh, Y ^a   Soejima, K ^b   Honda, H ^b   Mizuno, M ^a   Yamamichi, S ^a  

^a NEC CORPORATION   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Artificial intelligence; Costs; Fabrication; National electric code; Packaging; Power supplies; Resins; Resists; Ultra large scale integration; Wiring

Indexed keywords

ALUMINUM; ARTIFICIAL INTELLIGENCE; CHEMICAL MECHANICAL POLISHING; COSTS; ELECTRIC POWER SYSTEMS; ELECTRIC WIRING; ELECTROPLATING; FABRICATION; LIGHT SENSITIVE MATERIALS; PACKAGING; PHOTOSENSITIVITY; RESINS; ULSI CIRCUITS;

INTER-LAYER DIELECTRICS; NATIONAL ELECTRIC CODE; PHOTOSENSITIVE RESINS; POWER SUPPLY; PROCESS-ORIENTED; RESISTS; SIMPLE TECHNOLOGY; THICKNESS UNIFORMITY;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 70349452560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219750     Document Type: Conference Paper

References (4)

1. International Technology Roadmap for Semiconductors 2001 Edition, SIA, 2001.
2. T. Sakurai, "Super-connect", International Packaging Strategy Symposium, December, 2000, pp 19-26.
3. T. Kikkawa, "Critical Issues of ULSI Multilevel Interconnect Technology", Technical Report of The Institute of Electronics, Information and Communication Engineers, SDM2000-187, ISSN 0913-5685, Vol. 100, No. 603, January, 2001, pp 1-6, in Japanese.
4. T. Shimoto, K. Matsui, K. Kikuchi, Y. Shimada, and K.. Utsumi, "New high-density multilayer technology on PCB", IEEE Transactions on Advanced Packaging, vol.22, no.2, May, 1999, pp 116-122.