GPS SAW filter using a wafer level technique

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2007, Pages 937-940

  Shiba, F ^a   Yamazaki, M ^a   Iijima, O ^a   Yatsuda, H ^a  

^a JAPAN RADIO CO LTD   (Japan)

Author keywords

Assembly; GPS; SA wfilter; Wafer level

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC WAVE VELOCITY; CARBON DIOXIDE ARC WELDING; ELECTRIC CURRENTS; SAWING; ULTRASONICS; WAVE FILTERS;

ASSEMBLY; GPS; SA WFILTER; SAW FILTERS; WAFER LEVEL; WAFER LEVELS;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 48149090540     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.239     Document Type: Conference Paper

References (10)

1. H. Yatsuda, T. Horishima, T. Eimura and T. Ooiwa, "Miniaturized SAW filters using a flip-chip technique", in Proc. IEEE 1994 Ultrason. Symp., pp. 159-162, 1994.
2. H. Yatsuda and T. Eimura, "Flip-chip assembly technique for SAW devices", Intl. Journal of Microcircuits and Electronic Packaging, vol. 19, 3, pp. 238-244, 1996.
3. H. Yatsuda, "Modeling of parasitic effects for flip-chip SAW filters", in Proc. IEEE 1997 Ultrason. Symp., pp. 143-146, 1997.
4. O. Kawachi, K. Sakinada, Y. Kaneda and S. Ono, "Packaging of SAWdevices with small, low profile and hermetic performance", in Proc. IEEE 2006 Ultrason. Symp., pp. 2289-2292, 2006.
5. J. Lim, J. Hwang, J. Kwon, S. Ham, W. Kim, T. Kim, W. Jeung, S. Yang, S. Choi and J. Park, "An ultra small SAW RF filter using wafer level packaging technology", in Proc. IEEE 2006 Ultrason. Symp., pp. 196-199, 2006.
6. B. Wilkins, "Wafer level packaging of SAWs enables low cost 2.5G and 3G Radio Modules", in Proc. Third Int. Symp. on Acoustic Wave Devices for Future Mobile Communication Systems, pp. 179-184, 2007.
7. R.C.Ruby, A.Barfknecht,C.Han, Y.Desai.,F.Geefay,G.Gan,M.Gat,T. Verhoeven,"High-Q FBAR Filters in a Wefer-Level Chip-Scale Package", IEEE ISSCC 2002 conference, Feb.2002
8. M. Franosch,K.-G. Oppermann, A. meckes, W. Nessler, R.Aigner,"Wafer- Level-Package for Bulk Acoustic Wave (BAW) Filters" IEEE MTTS-SD gest 2004, pp.493-496.
9. H. Yatsuda, "SAW device assembly technology", in Proc. Int. Symp. on Acoustic Wave Devices for Future Mobile Communication Systems, pp. 189-194, 2001.
10. Xiao-Chen Fu,Guo-Wei Xiao,Pui-Chung Law,Philip Ching Ho chan,"The Effect of Pretretmeat Process on Electroless Nichel Bumping for Different Al Pads", Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conferenceon, Vol.1, Oct. 2004, pp. 603-606.