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Volumn 1, Issue , 2006, Pages 2289-2292

Packaging of SAW devices with small, low profile and hermetic performance

Author keywords

[No Author keywords available]

Indexed keywords

CAVITY STRUCTURE; COMMONLY USED; HIGH RELIABILITY; LOW PROFILE; METAL SEALING; MINIATURIZATION OF DEVICES; MODULE INTEGRATION; MOISTURE SENSITIVITY; PACKAGING TECHNIQUES; RELIABILITY TESTING; SA WFILTER; SAW DEVICE; SEALING PRESSURE; SMALL SIZE;

EID: 48149105797     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2006.468     Document Type: Conference Paper
Times cited : (12)

References (4)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.