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Volumn 1, Issue , 2006, Pages 2289-2292
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Packaging of SAW devices with small, low profile and hermetic performance
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CAVITY STRUCTURE;
COMMONLY USED;
HIGH RELIABILITY;
LOW PROFILE;
METAL SEALING;
MINIATURIZATION OF DEVICES;
MODULE INTEGRATION;
MOISTURE SENSITIVITY;
PACKAGING TECHNIQUES;
RELIABILITY TESTING;
SA WFILTER;
SAW DEVICE;
SEALING PRESSURE;
SMALL SIZE;
MINIATURE INSTRUMENTS;
RELIABILITY;
RESINS;
SEALING (CLOSING);
ACOUSTIC SURFACE WAVE FILTERS;
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EID: 48149105797
PISSN: 10510117
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ULTSYM.2006.468 Document Type: Conference Paper |
Times cited : (12)
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References (4)
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