The effect of pretreatment process on electroless nickel bumping for different Al pads

International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Volumn 1, Issue , 2004, Pages 603-606

  Fu, Xiao Chen ^a   Xiao, Guo Wei ^a   Law, Pui Chung ^a   Chan, Philip Ching Ho ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Electroless plating; Flip chip; Micro etch; UBM

Indexed keywords

ALUMINUM; ANNEALING; ELECTROLESS PLATING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MORPHOLOGY; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SPUTTERING;

ACID STRIPPING; ELECTROLESS NICKEL BUMPING; IBM (CO); PRETREATMENT PROCESS; UBM;

NICKEL;

EID: 21644487939     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. John H. Lau, "Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies", McGraw-Hill, p.43-89 (2000)
2. Rao R. Tummala, "Fundamentals of Microsystems Packaging", McGraw-Hill, p.361-390 (2001)
3. B.J. Moody, "Comparative Inorganic Chemistry", EDWARD ARNOLD (PUBLISHERS) LTD., London, p.249-254 (1965)
4. Q. Tan, C. Beddingfield, A. Mistry and V. Mathew, "Zincation Characterization for Electroless Ni/Au UBM of solder Bumping", Proc. IEEE/CPMT Int. Electronics Manufacturing Technology Symposium, p.34-40 (1998)
5. C. Liu, D.A. Hutt, D.C. Whalley and P.P. Conway, S.H. Mannan, "Under bump metallization of fine pitch flip-chip using electroless Nickel deposition", Electronic Materials and Packaging, P.64-71, (2000)
6. David A. Hutt, Changqing Liu, Paul P. Conway, David C. Whalley and Samjid H. Mannan, "Electroless Nickel Bumping of Aluminum Bondpads-Part I: Surface Pretreatment and Activation", IEEE Transaction on Components and Packaging Technologies, Vol. 25, No. 1, March 2002